Nvidia and Intel to host AI conferences in Seoul to deepen Korean ties

Strategic summits in Seoul

Nvidia and Intel are scheduled to host consecutive artificial intelligence conferences in Seoul next week. These events serve as a platform for the American chipmakers to broaden their connections with South Korean semiconductor and electronic component manufacturers. By hosting these summits, both companies aim to solidify their positions within the Korean hardware ecosystem.

Nvidia will launch 'AI Day Seoul 2026' at the COEX in the Gangnam district starting on the 9th. The two-day event is expected to draw 2,000 participants and will offer a mix of technology presentations, hands-on workshops, and special sessions. This format allows for both high-level strategy sharing and practical technical engagement with local engineers.

Intel will follow with its 'AI Summit Seoul 2026' at the same location on the 12th. The summit will feature keynote speeches from high-ranking executives to discuss the future of data center products and AI strategy. These events represent a coordinated effort by the two biggest names in the industry to court the specific expertise of Korean suppliers.

Showcasing software and hardware

The conferences will highlight how Korean firms are integrating specific software tools from Nvidia into their manufacturing workflows. Samsung Electronics plans to present a case study on using PhysicsNeMo, which is a software solution for analyzing physical phenomena during chip design. This demonstrates how AI can help predict and manage the complex physics involved in creating smaller, more efficient hardware.

SK hynix will also participate by outlining how they use CUDA-X to improve their production lines. CUDA-X is a software library designed to accelerate computing tasks, and SK hynix intends to use it to shorten the time required for simulations in chip manufacturing. These demonstrations show that the relationship between the companies is moving toward shared technical methodologies.

The events also feature high-level leadership from both sides of the Pacific. Nvidia's vice president of robotics and edge AI, Deepu Talla, and vice president of applied research, Jonathan Jonathan Cohen, will discuss strategies for physical and agentic AI. Additionally, Nvidia's senior director of product marketing, Madison Huang, is expected to attend the conference in person.

Expanding the supply chain

While the relationship between these companies and Korean firms has long centered on memory chips, it is now expanding into more complex components. Nvidia currently procures high-bandwidth memory (HBM) and other essential parts from Samsung Electronics and SK hynix. Intel similarly relies on Korean memory makers for DDR5 DRAM, which is a type of memory used in high-performance servers.

The upcoming summits are intended to push these partnerships into advanced hardware categories. This includes high-performance flip-chip ball grid array (FC-BGA) package substrates and silicon capacitors. These components are critical for the physical assembly of high-performance chips, moving the cooperation beyond just the raw materials of the memory itself.

By focusing on these specific components, Nvidia and Intel are attempting to create a more robust and vertically integrated supply chain. This strategy ensures that the specialized parts needed for next-generation AI hardware are produced by trusted partners who have experience with the latest software and design standards.

Scaling AI systems globally

A major theme of the Intel summit will be the efficient scaling of AI systems. Joo Young-pyo, a vice president at SK hynix, is scheduled to deliver a morning keynote regarding directions for memory and system design. His presentation will likely focus on how hardware can be optimized to handle the massive data demands of modern artificial intelligence.

The goal for both companies is to ensure that hardware can keep pace with the rapid growth of AI models. As these models become more complex, the underlying memory and substrate technology must be able to provide faster speeds and higher reliability. The collaboration with Korean firms is a primary way for these U.S. companies to achieve those technical goals.

Industry observers are watching closely to see if these conferences will result in new, formal agreements for expanded supply chain cooperation. The success of these summits will be measured by how many new contracts are signed for advanced components. The move highlights the interdependence of the global semiconductor market, where software, design, and manufacturing must align perfectly.